What Types of Testing Equipment Are Used in The SMT Process?

The production process of SMT processing is extremely complex, and each process is closely linked. Problems in any link will affect product quality. To enhance the quality of PCBA processing and soldering, professional testing equipment must be deployed in each process to achieve strict control of the quality of the production process.

Below, Shenzhen assypcb will focus on introducing the testing equipment used in SMT processing.

1. SPI testing equipment, namely the welding paste thickness gauge, is usually installed after the welding paste printing. Its main function is to detect the thickness, area, and volume distribution of welding paste printed on the PCB board. It is a key piece of equipment for monitoring the quality of welding paste printing.

2. Regarding AOI inspection, that is, automatic optical inspection equipment, this equipment can be configured in multiple links of the production line, it is usually placed after the reflow welding process. Its main function is to conduct a detailed inspection of the welding quality of the PCB board after reflow welding, to timely identify defects such as insufficient welding, missing components, cold welding joints, and bridging welding.

Next, the importance of AOI inspection equipment in SMT processing is explained :

During the automatic inspection process, the AOI equipment uses a camera to automatically scan the PCB, collect image data, and compare and analyze the test welding joints with the qualified parameters preset in the database. Through advanced image processing technology, the equipment can identify defects on the PCB and present or mark these defects through a display or automatic marking system, providing a basis for improvement for SMT process engineers, and also facilitating SMT maintenance personnel to make corresponding corrections. At present, automatic optical inspection instruments have become a widely used inspection tool in SMT factories, and show a clear trend of replacing traditional manual inspection.

This equipment is produced by assypcb and is an automatic optical inspection (AOI) equipment.

3. X-ray detection technology, which is usually used in hospitals, generates X-ray penetration by applying high voltage to the target material and is used to detect the internal structure and quality of electronic components and semiconductor packaging products, as well as the welding quality of various SMT welding joints. This technology is mainly used to detect BGA chips located at the bottom pins and can detect defects such as bridges, voids, and oversized or undersized welding joints on the BGA. X-ray detection technology can reveal objects that cannot be directly observed on the surface. However, due to its relatively high price, its application in small and medium-sized enterprises is limited.

4. ICT detection, that is, automatic online tester, has a wide range of applications and simple operation procedures. ICT automatic online tester mainly serves the production process control link, and can accurately measure resistance, capacitance, inductance, and integrated circuits. The detector is particularly efficient in identifying open circuits, short circuits, and component damage, and can accurately locate the fault point, thus facilitating maintenance. As a key tool for achieving quality control, SMT processing inspection equipment can effectively avoid the subjective deviation of manual visual inspection, thereby improving the accuracy and efficiency of detection.