SMT VS DIP

Abstract

The structure of semiconductor materials has changed and become complex over time, so packaging also needs to evolve. To complement and handle the complexity of semiconductors, new integrated circuit SMT and through-hole DIP plug-in components are divided into different names and categories based on mounting technology.

1. Through-hole DIP plug-in mounting technology

Through-hole DIP plug-in mounting involves different components that include wires and are mounted above the holes on the circuit board. That is why the name of through-hole DIP plug-in mounting is given to this technology. The leads rely on the holes on the multi-layer PCB, and then they are soldered for permanent mounting.

2. Surface mount technology

Surface mounting technology is a new technology that is based on complex integrated circuits. Surface mounting technology increases the number of pins in integrated circuits, and smaller size and lighter weight. Components are mounted directly on the surface of the printed circuit board instead of being mounted on the holes. This technology is being used in areas such as chip carrier packaging.

3. Conclusion

Assypcb SMT: There are many reasons why surface mounting technology called SMT is superior to through-hole DIP plug-in technology. Assypcb provides SMT and through-hole DIP plug-in assembly circuit boards. The biggest advantage of SMT circuit boards is that the size of the circuits is reduced, and more and more components can be integrated. One of the other advantages is that compared with through-hole DIP plug-in assembly circuits, SMT-based circuit boards have fewer technical failures and a longer service life.