LED Thermal Products
1. What are LED Thermal Products?
LED Thermal Products refers to heat management products designed for LED devices. Its core function is to reduce the operating temperature of LEDs by optimizing the heat conduction path to solve the problems of reduced efficiency, accelerated light decay, and shortened life of high-power LEDs caused by heat accumulation. This type of product includes core components such as heat dissipation substrates, heat sinks, and thermal interface materials.
2. What are the Types of LED Thermal Products?
1) Types of Heat Dissipation Technology
Active heat dissipation: It uses forced heat dissipation methods such as fans and liquid cooling, which is suitable for high-power density scenarios (such as LED lamps above 100W), but it is necessary to balance energy consumption and equipment volume.
Passive heat dissipation: It relies on the natural heat dissipation of heat sinks, which is low in cost but limited in efficiency. It is mostly used in low-power or space-constrained scenarios.
2) Thermal Resistance Management Strategy
Full-link thermal resistance control is performed from the chip level (optimizing materials and structures), the packaging level (improving electrode connection methods) to the system level (optimizing overall heat dissipation design) to ensure efficient heat dissipation.
3. Core Products and Material Innovation
1) Heat dissipation substrates
Ceramic substrates: Thick film/low temperature co-fired ceramics (LTCC) and thin film ceramic substrates (such as aluminum nitride AlN) have become the mainstream choice due to their high thermal conductivity (>170 W/mK), especially the thin film process can avoid the material failure problem of traditional processes.
Metal substrates (such as MCPCB): The heat dissipation capacity is improved through the composite structure of the insulating layer and the metal layer, which is suitable for medium and high-power LED packaging.
2) Heat dissipation structure design
Eutectic/flip chip technology: Replace the traditional wire bonding process, reduce the interface thermal resistance in the heat conduction path, and is suitable for high-density integrated LED modules.
Heat pipes and temperature spreaders: Use the phase change principle to quickly spread heat, suitable for large-size LED displays or automotive lighting systems.
4. Technology Development Trends of LED Thermal Products
Material innovation: Explore the application of high thermal conductivity materials such as silicon carbide (SiC) and diamond in substrates to further improve heat dissipation efficiency.
Integrated design: Integrate the heat dissipation substrate with the driving circuit to reduce the thermal resistance accumulation at the packaging level.
Intelligent control: Combine temperature sensors with dynamic heat dissipation control algorithms to achieve adaptive adjustment of the heat dissipation system.
5. What are LED Thermal Products Used for?
High-power lighting: Such as industrial searchlights and outdoor streetlights, which rely on the combination of active heat dissipation and high thermal conductivity substrates.
Automotive LED: Headlights and taillights need to use heat pipes and temperature-averaging plates to cope with high heat flux density in a small space.
Mini/Micro LED display: Thin-film ceramic substrates and flip-chip technology have become the key to achieving high pixel density display.