Raw Materials – Composites

1. What are the Basic Components of Composite Materials?

Resin Matrix: This includes thermosetting resins (such as unsaturated polyesters and epoxy resins) and thermoplastic resins (such as Dow Chemical’s Fulcrum products). Thermosetting resins dominate electronic substrates (such as PCBs) due to their low cost and excellent performance.

 

Reinforcing Fiber: These fibers, such as glass fiber, provide mechanical strength and dimensional stability and are commonly used in the manufacture of copper foil substrates (such as FR-4).

 

Additives: Fillers reduce costs (such as boron nitride insulators), flame retardants enhance safety, and release agents improve processing efficiency.

 

2. What are the Applications of Composite Materials?

Printed Circuit Boards (PCBs): Resin compositions serve as substrate materials, protecting circuits and ensuring insulation. Copper foil substrates achieve electrical conductivity through a composite of copper foil and resin.

 

Semiconductor Encapsulation: Resins are used to secure chips and require a low coefficient of thermal expansion and high heat resistance (such as polyimide resins).

 

High-Temperature Insulation: Boron nitride insulators, for example, can withstand temperatures exceeding 2000°C and are suitable for use in extreme environments.

 

3. Industry Trends and Challenges of Composite Materials

Thermoplastic vs. Thermoset: Thermoplastic resins are gaining attention due to their recycling advantages, but their high cost and processing difficulties limit their widespread adoption.

 

Environmental Requirements: The development of new, low-toxic resins, such as halogen-free flame-retardant materials, is being promoted.