Raw Materials – Foam

Foam materials (such as polyurethane and polypropylene carbonate) offer low density, high specific strength, low thermal conductivity, and excellent sound insulation, making them suitable for cushioning, insulation, and lightweighting requirements in electronic components. For example, polypropylene carbonate (PPC) is an emerging choice for electronic foam materials due to its environmental friendliness and high impact resistance. Foam materials are commonly used in chip packaging, circuit board protection, and consumer electronics (such as smartphone foam bonding).