Raw Materials – Plastics

1) Core Functions

Provides signal pathways, heat dissipation support, current connection, and mechanical protection for semiconductor chips, directly impacting the device’s electrical, thermal, and mechanical performance and reliability.

 

Four major functions: signal input/output, heat dissipation, current conduction, and environmental protection.

 

2) Engineering Plastic Requirements

Electrical Properties: High resistivity and low dielectric constant (e.g., high-frequency connectors require low dielectric loss).

 

Flame Retardancy: Must comply with safety certifications (e.g., UL94 V-0), with halogen-free flame retardant materials preferred to balance performance and environmental friendliness.

 

Mechanical Properties: Strength and toughness must be tailored to the product structure (e.g., housings require impact resistance, gears require wear resistance).

 

3) Common Materials

General-purpose Plastics: ABS (high impact strength), PP (chemical resistance).

 

High-Performance Engineering Plastics: PC (optical lenses), POM (precision gears), PPS (high-temperature sensors).

 

4) Typical Applications

flexible electronic substrates (polyimide), circuit board adhesive layers (epoxy resin), and electronic housings (ABS/PC).