Dispensing Equipment
Dispensing equipment is a core component of precision dispensing processes, primarily used to precisely dispense materials such as glue and solder paste to designated locations.
1. What are the Technical Features of Dispensing Equipment?
1) Precision Control
Utilizing a multi-axis robotic arm (e.g., XYZ) and a micron-level nozzle, this system achieves repeatable positioning accuracy of ±0.02mm, supporting micro-dispensing of various materials, including UV adhesive and conductive adhesive (down to nanoliters).
2) Automated Integration
Modern equipment is commonly equipped with vision positioning systems (e.g., CCD detection) and intelligent control modules, enabling automatic identification of pad locations and parameter adjustments, enabling data integration with MES systems.
3) Process Compatibility
Material Compatibility: This system supports a wide range of processes, from low-viscosity conformal coatings to high-viscosity thermal adhesives, with flow rate control via pressure or screw-type feeding systems.
Environmental Control: Select models feature integrated temperature control modules (e.g., ±1°C accuracy) and vacuum sealing capabilities, meeting the demands of demanding applications such as aerospace.
2. What are the Typical Applications of Dispensing Equipment?
1) Electronic Packaging
Chip Bonding: Used for wafer-level conductive adhesive dispensing in semiconductor manufacturing, such as EV Group’s SET ACCμRA OPTO device.
BGA Packaging: Micron-level atomizing nozzles prevent pad bridging, increasing yield by 18%.
2) Component Protection
Conformal Coating: Selectively spray coating PCBs, achieving IP67 protection.
LED Packaging: Uses two-component metering pumps (such as ViscoTec’s vipro-DUO) to achieve high-precision injection of lens resin.
3) Emerging Fields
In AR/VR device manufacturing, dispensing technology is used for miniaturized bonding of optical modules (gap <0.1mm), requiring low shrinkage and high light transmittance.
3. Technology Development Trends of Dispensing Equipment
Intelligent: Digital twin technology simulates spraying results, and AI visual inspection boasts an accuracy rate exceeding 99% for defect recognition.
Greening: Powder coating technology reduces VOC emissions and achieves a 95% material recovery rate.
Micro- and Nano-scale Processing: Graphene coatings and self-healing materials are expanding their applications.
Currently, dispensing equipment is evolving from single-function systems to multifunctional integrated platforms, becoming a key enabler for the upgrade of electronics manufacturing towards high precision and high reliability.